A quad-phase power module delivering high current density and fast transient response, enabling compact, efficient AI servers and next-generation accelerator performance.
Infineon Technologies has introduced the TDM24745T, a quad-phase power module designed to meet the growing power delivery demands of next-generation AI processors and data center accelerators. The module uses trans-inductor voltage regulator (TLVR) technology to deliver current density above 2 A/mm², enabling compact and responsive power delivery for high-performance AI workloads.
As AI accelerators scale, power architectures need to become more efficient, dense, and capable of fast transient response. The TDM24745T addresses these requirements by integrating four power stages, a TLVR inductor, and decoupling capacitors into a compact 9 x 10 x 5 mm package. This allows the module to support peak currents up to 320 A, meeting the high-current demands of advanced GPUs and multiprocessor platforms.
The module provides several advantages for system designers as it simplifies power architecture by reducing component count, increases power density to free up PCB space for additional compute resources, and offers fast transient performance. The TLVR topology can reduce the required output capacitance by up to 50 percent, enabling more efficient, space-saving layouts and supporting energy savings in AI server deployments.
Designed for scalability, the TDM24745T works with Infineon’s digital multiphase controllers to support flexible architectures. It incorporates OptiMOS-6 MOSFETs, embedded magnetics, and integrated components to maintain high efficiency and thermal performance even in dense server configurations.
“As AI workloads scale at unprecedented speed, the need for highly efficient and compact power delivery has never been greater,” said Athar Zaidi, Senior Vice President and GM of Power ICs and Connectivity at Infineon. “The TDM24745T combines industry-leading current density with TLVR technology to unlock more compute performance, reduce energy consumption, and accelerate AI data center deployment.”
By combining high current density, fast transient response, and compact integration, the TDM24745T provides a versatile solution for next-generation AI compute platforms.
Click here for the official announcement.