Can power density scale without increasing footprint? A new inductor design combines high current handling with compact size for efficient PCB layouts.
Bourns has introduced the SRP2008DP Series of high-current shielded power inductors, designed for DC-DC conversion in space-constrained electronic systems. The series combines high current capability with a low-profile 0.8 mm package, enabling efficient power design without increasing board footprint.
As electronic systems continue to shrink while handling higher power loads, designers face increasing pressure to balance performance, size, and electromagnetic compatibility. Conventional shielded inductors help reduce interference but often occupy more space, limiting layout flexibility. The series addresses this by integrating a metal-alloy powder core within a compact 2.0 × 1.6 mm footprint, offering both shielding and space efficiency.
The inductors are engineered to maintain signal integrity in dense PCB layouts. Their shielded construction contains magnetic flux, reducing radiated emissions and minimizing interference with nearby components. The metal-alloy core further improves efficiency by suppressing eddy currents and reducing core losses, particularly at higher switching frequencies. These characteristics help support stable operation in noise-sensitive environments.
In terms of specifications, the series supports an inductance range from 0.24 μH to 4.70 μH, with saturation current ratings up to 5.50 A. It is designed to operate across a temperature range of -40°C to +125°C, making it suitable for both consumer and industrial applications. Despite its compact size, the inductor maintains consistent performance under high current conditions.
The SRP2008DP Series is targeted at applications including portable electronics, IoT devices, and compact industrial systems, particularly where board space and height are limited.
“With increasing system complexity and shrinking form factors, engineers need components that deliver both performance and efficiency without adding layout challenges,” says Craig Wedley, Magnetic Products Engineering Director at Bourns“This series provides the benefits of shielded, high-current inductors in a footprint that supports compact, high-density designs.”
Click here for the official announcement.