Wed. Jul 23rd, 2025

High-Performance Module For AI

cExpress R8 F


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Boost Power Density

The computer board runs AI, shows four screens, uses less power, and works in places like factories, hospitals, and machines.

AMD Ryzen™ Embedded 8000 Series with RDNA™ 3 and XDNA™ Delivers Up to 40 TOPS for Edge AI
AMD Ryzen Embedded 8000 Series with RDNA 3 and XDNA Delivers Up to 40 TOPS for Edge AI

ADLINK Technology has released the cExpress-R8, a Compact Type 6 COM Express module built for high-performance, low-power edge applications. Based on the COM.0 R3.1 standard, it supports AMD Ryzen Embedded 8000 Series processors and delivers powerful compute, AI, and graphics capabilities—ideal for machine vision, robotics, medical systems, and smart HMIs.

With up to 8 AMD “Zen 4” CPU cores, integrated AMD RDNA™ 3 graphics, and an XDNA NPU offering up to 40 TOPS AI performance, the cExpress-R8 enables fast inferencing and real-time decision-making without heavy power draw. This combination helps tackle complex AI workloads while optimizing performance-per-watt.

Designed for industrial reliability, the module supports up to 96GB DDR5 memory at 5600 MT/s, with both ECC and non-ECC options. ECC memory is especially valuable in automation, transportation, and other mission-critical applications, where system stability is vital.

The module offers up to four independent display outputs, including DP, eDP, HDMI, and LVDS, with options for VGA and additional eDP, making it adaptable for various display needs in edge deployments.

Some of the Key Specifications of the  cExpress-R include:

  • AMD Ryzen Embedded 8000 Series processors
  • AMD RDNA 3 graphics and XDNA NPU (up to 40 TOPS)
  • Up to 96GB DDR5 5600 MT/s memory (ECC/non-ECC)
  • Four independent display outputs
  • 10-year product lifecycle
  • Development kits available Q4 2025

Built for long-term use, the cExpress-R8 features a 10-year product lifecycle, making it well suited for next-generation systems that require scalability and longevity.

By uttu

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