The radar design helps smart devices detect people while using less power and cost. It has a built-in antenna, USB connection, and two-layer board.
Texas Instruments’ TIDA-010967 is a reference design that demonstrates how to build a low-cost, low-power radar module using the IWRL6432AOP mmWave sensor. It is aimed at smart devices such as motion detectors, smart locks, video doorbells, and IP cameras, where detecting human presence is needed to wake the system from sleep. The design streams radar data and classification results to a PC via a UART-to-USB interface for visualization. This makes it suitable for applications requiring presence detection and basic object classification.
The module integrates a 57GHz to 64GHz radar sensor and is built on a compact 22.8mm × 59mm two-layer PCB made from FR4. The board supports connection to other devices using either castellated pads or a 1.27mm pitch connector. It can operate as a standalone radar module or connect to TI’s TIDA-010254 base board, which features the CC1352R wireless microcontroller. This MCU supports long-range wireless communication and low-power operation, with multiprotocol support for Bluetooth LE 5.2, Zigbee, IEEE 802.15.4, and sub-1 GHz communication.
The design is powered by a 5V input from either a USB port or a DC power adapter. A TPS628502 buck converter steps this down to 3.3V, which powers various parts of the circuit. An onboard regulator then generates a 1.8V supply for the internal blocks of the mmWave sensor. Alternatively, users can supply 3.3V directly through the castellated pads when integrating with custom controllers or test setups. This flexibility supports multiple system architectures without additional components.
The PCB is divided into two main sections. One section houses the mmWave radar sensor and a buck converter that steps down from 3.3V to 1.8V. The other section includes the USB and wireless interface, including an FT230XS USB-to-UART converter and an additional buck converter. These two sections can be physically separated along defined cut lines. Once separated, the radar sensor module can be used independently, with connections made through the castellated pads.
Signal routing uses available space near the horizontal edges and center of the mmWave sensor BGA package, avoiding via-in-pad to simplify manufacturing and cut costs—especially important for two-layer PCBs. Designers must work within tight layout limits, keeping tall components out of the antenna’s field of view and using edge BGA pads for efficient signal routing.
To keep costs low, several optimization techniques are used. The design uses a standard two-layer PCB, which reduces fabrication complexity by avoiding buried or blind vias and limiting plating cycles. FR4 is chosen as the base material because it offers adequate thermal and electrical performance at a lower cost. Since the mmWave sensor already includes an Antenna-on-Package (AoP), there is no need for expensive high-frequency laminates, further lowering material costs.
TI has tested this reference design. It comes with a bill of materials (BOM), schematics, assembly drawing, printed circuit board (PCB) layout, and more. The company’s website has additional data about the reference design. To read more about this reference design, click here.
