A unified approach brings thermal systems, orchestration software and energy infrastructure together as AI workloads push data centres toward new limits.
LG Electronics has presented its integrated cooling solutions for AI data centers at Data Center World 2026 in Washington, D.C. The solutions are designed to address increasing thermal loads from AI and high-performance computing environments. LG’s Direct-to-Chip cooling lineup uses liquid cooling with optimized cold plate designs and a 1.4 MW coolant distribution unit to manage heat at the processor level. Supporting systems such as computer room air handlers and air-cooled chillers extend cooling across the facility.
In addition to direct cooling, the company is expanding into immersion cooling through collaborations with Green Revolution Cooling and SK Enmove. These systems submerge IT hardware in dielectric fluids, enabling stable operation under high thermal loads.
To improve operational efficiency, the company has introduced Data Center Cooling Management software, which integrates monitoring and control across cooling infrastructure. The platform supports predictive maintenance, anomaly detection, and real-time optimization based on workload conditions, enabling more efficient resource utilization.
On the power side, LG is showcasing a direct current grid solution developed with LS ELECTRIC and LG Energy Solution. By reducing power conversion stages typical in alternating current systems, the approach lowers energy losses and improves overall efficiency, particularly when combined with renewable energy sources.
“AI data centers require advanced cooling technologies, but they also need power and operations to work together in a more integrated way,” said James Lee, president of the LG ES Company, offering solutions that improve performance and support greater energy efficiency.”
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