What if packaging could connect without adding bulk? These NFC tags can enable scalable, low carbon digital interaction across everyday products and retail environments.
Tageos has launched new FlexIC based RFID and NFC product lines, EOS Lite and EOS Zero Lite, developed in partnership with Pragmatic Semiconductor to enable low carbon, scalable item level connectivity for smart packaging and retail applications.
The product families are built around flexible integrated circuit technology, targeting the challenge of embedding digital functionality into everyday products without significantly increasing material usage or design complexity. Designed for high volume deployment, the solutions can be integrated into packaging and labels while remaining compatible with existing manufacturing and recycling processes.
At the core of the offering is the Pragmatic NFC Connect PR1301 chip, an ultra thin and flexible component that enables embedding into paper based and curved surfaces. The EOS 932 Zero Lite PR1301, the first product in the range, is a paper based NFC inlay designed for integration into packaging, supporting use cases such as product authentication, consumer interaction, and supply chain traceability. Its low profile allows integration without altering the appearance or structure of the packaging.
A key aspect of the design is its focus on material efficiency. By combining lightweight antenna structures with flexible semiconductor technology and paper based substrates, the solution reduces the amount of material required compared to conventional RFID inlays, while also supporting improved recyclability.
Beyond this, the platform enables item level identification and interaction through smartphones, allowing products to be linked with digital services. This can support applications such as verification, consumer engagement, and data collection across the product lifecycle.
“Our close collaboration with Pragmatic Semiconductor combines innovation with a clear vision for sustainability,” says Matthieu Picon, CEO of Tageos. “The new FlexIC based product lines open new possibilities for brands to connect to their customers through their products.”
“Together, we are shaping a new era of smarter packaging,” adds David Moore, CEO of Pragmatic Semiconductor. “This enables direct consumer engagement, product authentication, and transparency at scale.”