According to a recent leak from tipster Digital Chat Station, the second half of 2025 will see new flagship chips from all major players in the mobile silicon market. This not only includes Apple, Qualcomm, and MediaTek, but also Huawei.
DCS claims that Apple’s A19 Pro chip will debut in September, continuing the company’s yearly cadence. Qualcomm is expected to follow shortly after with its next flagship SoC, Snapdragon 8 Elite 2, internally known as SM8850.
Both Apple and Qualcomm are said to be utilizing TSMC’s N3P node, a refinement of the foundry’s current 3nm process. The tipster says these upcoming chips will hit a new high in frequency (i.e., clock speed) and will have improved energy efficiency over the previous generation.
Huawei Kirin 9030 is a surprise
MediaTek’s high-end chip, possibly named Dimensity 9500, will also launch by September end. Meanwhile, Huawei’s Kirin 9030 is reportedly scheduled for release toward the end of the year.
We’re sure to learn more about the Dimensity 9500 or any chip, for that matter, in detail when it launches. But Huawei, as in the past, might keep the specifics of the Kirin 9030 under wraps. If timelines hold, all four flagship processors will enter the market between late 2025 and early 2026.
Elsewhere in the comments section of the leak, discussion emerged about Xiaomi’s in-house XRING processor. DCS says Xiaomi CEO Lei Jun did not expect the first-generation XRING O1 to perform so well, so there were no plans for its successor. However, DCS claims the XRING O2 will be even “more popular.”
Separately, a report from IT Home this morning suggests that Apple is preparing to launch M5 chips this fall in new versions of the iPad Pro and MacBook Pro. The update is likely to be limited to the processor itself, with little else changing in the hardware design or features.
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