DNA origami paves a way to position quantum emitters on chips. Here’s how scientists are making it possible.
An international research team from Nanjing University, Skolkovo Institute of Science and Technology, and LMU Munich has developed a novel technique for precisely positioning quantum light sources on semiconductor chips using DNA origami, marking an important step toward scalable quantum technologies.
One of the major obstacles in quantum communication and computing has been the difficulty of reliably creating and placing single photon emitters. Traditional fabrication methods often depend on randomly formed defects, resulting in inconsistent performance and limited control. To overcome this, the researchers combined DNA nanotechnology with atomically thin semiconductor materials to engineer highly ordered hybrid structures.
Their approach uses triangular DNA origami templates embedded with thiol molecules that act as programmable anchors. Monolayers of molybdenum disulfide, or MoS2, are then transferred onto these patterned templates, leading to the formation of arrays of solid state single photon emitters. These emitters exhibit stable optical behavior, including nanosecond scale lifetimes and minimal fluctuations in signal intensity.
A key advantage of the method is its tunability. By adjusting the spacing and arrangement of the DNA patterns, the team can control both the number and exact positions of the emitters. This deterministic placement represents a significant improvement over previous techniques.
At the nanoscale, the process relies on interactions between thiol molecules and sulfur vacancies within MoS2. When binding occurs, localized sites are created that trap excitons and enable efficient single photon emission. The system achieves a high placement yield of about ninety percent, with positioning accuracy near thirteen nanometers, along with strong spectral stability.
Although currently a proof of concept, the fabrication strategy is compatible with large scale manufacturing. It could potentially be extended to wafer level production, enabling integrated quantum photonic circuits. The platform also offers flexibility for further optimization, such as tuning molecular components to enhance photon purity or enable advanced functionalities, paving the way for compact and reliable quantum devices.
Future research may explore integrating this approach with existing chip fabrication ecosystems and testing performance under practical operating conditions. Such efforts could accelerate the transition from laboratory demonstrations to commercially viable quantum communication systems and next generation computing platforms globally.