Analyst Ming-Chi Kuo revealed last month that OpenAI was developing an AI-agent smartphone slated for mass production in 2028. It seems the timeline has been brought forward, as Kuo shares some early specifications of the device.
Kuo says the OpenAI smartphone is now expected to enter mass production in the first half of 2027. The analyst adds that the accelerated timeline is probably due to the growing AI phone market, and a potential year-end IPO.
OpenAI phone will come with a custom Dimensity 9600 SoC
Ming-Chi Kuo shared some specifications of OpenAI’s AI agent-focused smartphone. He says MediaTek will likely be the sole SoC supplier of a customised Dimensity 9600 chipset. It will be built on TSMC’s N2P process in the second half of 2026.
The imaging will also be a clear focus for the AI phone. The ISP tipped will feature an enhanced HDR pipeline that will improve real-world visual sensing. The OpenAI phone will also feature a dual-NPU architecture for AI workloads, LPDDR6 RAM and UFS 5.0 storage. Coming to security front, it will support pKVM and inline hashing.
Kuo adds that if the development of the phone remains on track, the total shipments in 2027 and 2028 could be up 30 million units.
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